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- Bow and warp of semiconductor wafers and substrates
Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above This definition follows ASTM F657, [2] and ASTM F1390
- IMAPS-warpage_rev_rps - onsemi
One of the major drawbacks of wafer thinning is increase in wafer warpage and fragility It is important to minimize warpage in order to achieve optimal wafer deposition and die yield
- Warpage in wafer-level packaging: a review of causes, modelling, and . . .
As semiconductor companies strive to develop cutting-edge packages, wafer warpage remains an intrinsic and persistent issue affecting yield and reliability at both the wafer and package levels
- Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned . . .
After being subjected to high temperature passivation processes, the film stress can increase significantly and lead to warped wafers Warpage of various metalized wafers was characterized across a broad range of variables
- Stress-induced warpage estimation of advanced semiconductor copper . . .
The growth of the semiconductor industry is driven by the demand for electronic products and high transistor density However, complex manufacturing processes generate residual stress and result in wafer warpage Therefore, mastering wafer warpage has become a crucial challenge
- Multi-Step Mechanical and Thermal Homogenization for the Warpage . . .
However, these deep vias often cause warpages during the processing stage This study focuses on the numerical modeling of wafer warpage that occurs during the deposition of three thin layers onto these vias A multi-step mechanical and thermal homogenization approach is proposed to estimate the warpage of the silicon wafer
- A Predictive Model of Wafer-to-Die Warpage Simulation
To avoid any warpage-induced failures in electronic packaging such as crack and delamination, wafer and die warpage must be well understood and controlled Therefore, a reliable numerical model to simulate the wafer fabrication process and to obtain step-by-step wafer warpage is very much needed
- Predictive Simulations of Warpage Phenomena on Arbitrarily . . . - COMSOL
In this simulation, we aim to comprehend the origin and mechanism of the warpage phenomenon in patterned silicon wafers, which are key components in the field of microelectronics
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